LG L890 SmartLEDTM - Digi-Key

SmartLEDTM
LG L890
Besondere Merkmale
Features
• Gehäusetyp: SMT Gehäuse SCD 80
• Besonderheit des Bauteils: kleinste Bauform
1,7 mm x 0,8 mm x 0,65 mm (LxBxH)
• Wellenlänge: 570 nm
• Abstrahlwinkel: extrem breite
Abstrahlcharakteristik (160°)
• Technologie: GaP
• optischer Wirkungsgrad: 2,5 lm/W
• Gruppierungsparameter: Lichtstärke
• Verarbeitungsmethode: für alle
SMT-Bestücktechniken geeignet
• Lötmethode: IR Reflow Löten und
Wellenlöten (TTW)
• Vorbehandlung: nach JEDEC Level 2
• Gurtung: 8 mm Gurt mit 5000/Rolle bzw.
10000/Rolle, ø180 mm
• package: SMT package SCD 80
• feature of the device: smallest package
1.7 mm x 0.8 mm x 0.65 mm (LxWxH)
• wavelength: 570 nm
• viewing angle: extremely wide (160°)
• technology: GaP
• optical efficiency: 2.5 lm/W
• grouping parameter: luminous intensity
• assembly methods: suitable for all
SMT assembly methods
• soldering methods: IR reflow soldering and
TTW soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 8 mm tape with 5000/reel resp.
10000/reel, ø180 mm
Anwendungen
Applications
• Informationsanzeigen im Innenbereich
• optischer Indikator
• Flache Hinterleuchtung (LCD, Mobile Phone,
Schalter, Display)
• Spielsachen
• indoor displays
• optical indicators
• flat backlighting (LCD, cellular phones,
switches, displays)
• toys
2002-12-10
1
LG L890
Typ
Emissionsfarbe
Color of
Emission
Type
LG L890-K1L1-1 green
LG L890-L1M2-1
Gehäusefarbe Lichtstärke
Lichtstrom
Bestellnummer
Color of
Package
Luminous
Flux
IF = 20 mA
ΦV (mlm)
Ordering Code
40 (typ.)
80 (typ.)
Q62703Q6022
Q62703Q6156
colorless
diffused
Luminous
Intensity
IF = 20 mA
IV (mcd)
7.1 … 14.0
11.2 … 28.0
Anm.: -1 gesamter Farbbereich (siehe Seite 4)
Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe,
die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhältlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Note: -1 Total color tolerance range (see page 4)
The standard shipping format for serial types includes a lower or upper family group of 3 or 4
individual groups. Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
2002-12-10
2
LG L890
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebstemperatur
Operating temperature range
Top
– 40 … + 100
°C
Lagertemperatur
Storage temperature range
Tstg
– 40 … + 100
°C
Sperrschichttemperatur
Junction temperature
Tj
+ 110
°C
Durchlassstrom
Forward current
IF
20
mA
Stoßstrom
Surge current
tp = 10 µs, D = 0.1
IFM
100
mA
Sperrspannung1)
Reverse voltage
VR
12
V
Leistungsaufnahme
Power consumption
Ptot
95
mW
500
K/W
290
K/W
Wärmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Rth JA
Junction/ambient
Rth JS
Sperrschicht/Lötpad
Junction/solder point
Montage auf PC-Board FR 4 (Padgröße ≥ 5 mm 2)
mounted on PC board FR 4 (pad size ≥ 5 mm 2)
1)
für kurzzeitigen Betrieb geeignet / suitable for short term application
2002-12-10
3
LG L890
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge des emittierten Lichtes
Wavelength at peak emission
IF = 20 mA
(typ.)
λpeak
572
nm
Dominantwellenlänge 1)
Dominant wavelength 1)
IF = 20 mA
(typ.)
λdom
570
±6
nm
Spektrale Bandbreite
Spectral bandwidth
IF = 20 mA
(typ.)
∆λ
25
nm
Abstrahlwinkel bei 50 % IV (Vollwinkel)
Viewing angle at 50 % IV
(typ.)
2ϕ
160
Grad
deg.
Durchlassspannung 2)
Forward voltage 2)
IF = 20 mA
(typ.)
(max.)
VF
VF
2.2
2.5
V
V
Sperrstrom
Reverse current
VR = 12 V
(typ.)
(max.)
IR
IR
0.01
10
µA
µA
Temperaturkoeffizient von λpeak
Temperature coefficient of λpeak
IF = 20 mA; –10°C ≤ T ≤ 100°C
(typ.)
TCλpeak
0.11
nm/K
Temperaturkoeffizient von λdom
Temperature coefficient of λdom
IF = 20 mA; –10°C ≤ T ≤ 100°C
(typ.)
TCλdom
0.07
nm/K
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 20 mA; –10°C ≤ T ≤ 100°C
(typ.)
TCV
– 1.4
mV/K
Optischer Wirkungsgrad
Optical efficiency
IF = 20 mA
(typ.)
ηopt
2.5
lm/W
1)
Wellenlängen werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.
2)
Spannungswerte werden mit einer Stromeinprägedauer von 1 ms und einer Genauigkeit von ±0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V.
2002-12-10
4
LG L890
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstärke
Luminous Intensity
IV (mcd)
K1
K2
L1
L2
M1
M2
7.1 …
9.0 …
11.2 …
14.0 …
18.0 …
22.4 …
9.0
11.2
14.0
18.0
22.4
28.0
Lichtstrom
Luminous Flux
ΦV (mlm)
30 (typ.)
40 (typ.)
50 (typ.)
65 (typ.)
80 (typ.)
100(typ.)
Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ± 11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of ± 11%.
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: K1
Example: K1
Lichtgruppe
Halbgruppe
Luminous Intensity Group Half Group
K
2002-12-10
1
5
LG L890
Relative spektrale Emission Irel = f (λ), TA = 25 °C, IF = 20 mA
Relative Spectral Emission
V(λ) = spektrale Augenempfindlichkeit
Standard eye response curve
OHL01098
100
%
Irel
80
Vλ
60
green
40
20
0
400
450
500
550
600
650
nm
700
λ
Abstrahlcharakteristik Irel = f (ϕ)
Radiation Characteristic
40˚
30˚
20˚
10˚
ϕ
0˚
OHL01441
1.0
50˚
0.8
60˚
0.6
70˚
0.4
80˚
0.2
0
90˚
100˚
2002-12-10
1.0
0.8
0.6
0.4
0˚
6
20˚
40˚
60˚
80˚
100˚
120˚
LG L890
Durchlassstrom IF = f (VF)
Forward Current
TA = 25 °C
Relative Lichtstärke IV/IV(20 mA) = f (IF)
Relative Luminous Intensity
TA = 25 °C
OHL01263
10 2
OHL01449
10 1
IV
I F mA
IV (20 mA)
10 0
10 1
5
10 -1
10 0
10 -2
5
10 -1
1
1.4
1.8
2.2
2.6
10 -3 -1
10
3 V 3.4
VF
OHL00045
OHL00046
30
30
25
25
25
R thja =R500
290 K/W
thjs =K/W
20
20
15
15
15
10
10
10
5
55
ambient
TSA temp. solder
point
0
R thja = 500 K/W
R thja = 500 K/W
TA temp. ambient
00
00 10
10 20
20 30
30 40
40 50
50 60
60 70
70 80
80 ˚C 100
100
0 10 20 30 40 50 60 70 80 ˚C 100
T
2002-12-10
mA 10 2
OHL01456
OHL00045
40
40
mA
mA
IIFF
35
35
30
20
5 10 1
I
Maximal zulässiger Durchlassstrom IF = f (TA)
Max. Permissible Forward Current
TA: temp. ambient
Maximal zulässiger Durchlassstrom IF = f (TA)
Max. Permissible Forward Current
TS: temp. solder point
40
IF mA
35
5 10 0
TTA
7
LG L890
Relative Lichtstärke IV/IV(25 °C) = f (TA)
Relative Luminous Intensity
IF = 20 mA
OHL01101
2
IV
IV (25 ˚C)
1.6
1.2
green
0.8
0.4
0
0
20
40
60
80 ˚C 100
TA
2002-12-10
8
LG L890
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
LG
0.12
IF A
0.10
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
LG
OHL00759
t
D = TP
0.12
IF A
tP
IF
T
0.06
IF
T
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
0.08
0.06
0.04
0.04
0.02
0.02
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
0 -5
10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2
0 -5
10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2
tp
tp
2002-12-10
t
D = TP
0.10
D=
0.08
OHL00760
tP
9
LG L890
Maßzeichnung
Package Outlines
0.3 (0.012)
5˚
7˚ max
Cathode
marking
1.3 (0.051) ±0.1 (0.004)
Cathode
marking
(0.002)
0.125 (0.005) +0.05
-0.03 (0.001)
1.7 (0.067) ±0.1 (0.004)
0.8 (0.031) ±0.1 (0.004)
(0.001)
0.65 (0.026) +0.02
-0.05 (0.002)
GPLY6057
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 1.4 mg
2002-12-10
10
LG L890
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil
(nach IPC 9501)
IR Reflow Soldering Profile (acc. to IPC 9501)
OHLY0597
300
˚C
T
250
240-245 ˚C
10-40 s
200
183 ˚C
120 to 180 s
Ramp-down rate up to 6 K/s
150
Defined for Preconditioning: up to 6 K/s
100
Ramp-up rate up to 6 K/s
50
Defined for Preconditioning: 2-3 K/s
0
0
50
100
150
200
t
2002-12-10
11
s
250
LG L890
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
T
10 s
250
Normalkurve
standard curve
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
200
1. Welle
1. wave
150
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
100
2 K/s
50
Zwangskühlung
forced cooling
0
0
50
100
150
200
t
2002-12-10
12
s
250
LG L890
Empfohlenes Lötpaddesign
Recommended Solder Pad
IR Reflow Löten
IR Reflow Soldering
0.35 (0.014)
1.45 (0.057)
0.35 (0.014)
OHPY1301
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat
0.35 (0.014)
0.8 (0.031)
2.25 (0.089)
0.225 (0.009)
Empfohlenes Lötpaddesign verwendbar für SmartLEDTM und Chipled - Bauform 0603
IR Reflow Löten
Recommended Solder Pad useable for SmartLEDTM and Chipled - Package 0603
IR Reflow Soldering
0.3 (0.012)
0.5 (0.020)
0.65 (0.026)
OHPY0203
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Empfohlene Lötpastendicke: 120 µm/ recommended thickness of solder paste: 120 µm
Gehäuse für Wellenlöten (TTW) geeignet / Package suitable for TTW-soldering
2002-12-10
13
LG L890
2.04 (0.080)
8 (0.315)
1.4 (0.055)
4 (0.157)
3.5 (0.138)
1.5 (0.059)
1.75 (0.069)
Gurtung / Polarität und Lage
Method of Taping / Polarity and Orientation
C
A
2 (0.079)
0.4 (0.016)
0.93 (0.037)
OHAY1350
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Verpackungseinheit:
8 mm Gurt mit 5000/Rolle, ø180 mm
8 mm Gurt mit 10000/Rolle, ø180 mm (auf Anfrage)
Packing unit:
8 mm tape with 5000/reel, ø180 mm
8 mm tape with 10000/reel, ø180 mm (on request)
2002-12-10
14
LG L890
Revision History: 2002-12-10
Previous Version:
Date of change
2002-11-18
Page
Subjects (major changes since last revision)
2
changed resin from colorless clear to colorless diffused
12
recommended solder pad
9
Package Outlines
3
pad size from 16 mm2 to 5 mm2
3
Surge current
9
Permissible Pulse Handling Capability
15
annotations
2002-07-23
3, 4
value (reverse voltage from 5 V to 12 V)
2002-09-18
1, 14
tape with 5000/reel and 10000/reel instead of 10000
2002-12-10
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don’t represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2002-12-10
15